High-end WSD-880 full auto BGA rework equipment to repair laptop/desktop/ps3/xbox board

Model Number: WDS-880 auto BGA rework equipment Brand Name: WDS-880 auto BGA rework equipment Key Specifications/Special Features: Features:1. Independent 3 temperature zones control system Upper and lower temperature zones with hot air heating, IR preheating area with infrared heating, upper and lower temperature zones can heating from the top of the components and the bottom of PCB board at the same time. Manual operation move freely along with the X.Y axis in the bottom of the IR preheating area; temperature precision within ±2℃, upper and lower heater can set 8 sections temperature control at the same time; IR preheating on BGA chips and PCB board at the same time, together with the big area infrared heating heater can preheat the PCB board bottom fully to ensure no deformation to the board, by selecting separately using the upper or lower temperature zones, and lower temperature zones, and free combination the upper and lower heating element energy. Full auto BGA rework equipment2. High-precision K-type thermocouple with close-loop control, PID auto-tuning system temperature system, showed 7 temperature curves and saved multiple groups profiles, instant curve analysis function, downloaded thousands of data, external temperature interface can detect the temperature precisely, analyze and adjust the real BGA temperature curve accurately at any time.3. Precision optical alignment system, high-definition CCD color optical vision system, splitting, amplification, micro-adjust and auto-focus: with automatic color resolution and brightness adjustment device,, it can adjust the definition of the image automatically; with15" TFTLCD monitor, high automation, no human errors, for such lead-free socket 775 and double BGA /CGA/IC and various shielding device repairing can meet the requirement of the lead-free process. Full auto BGA rework equipment4. Multifunction and humanized operation interface human-machine high definition interface. Can set "set up inter face" and " operation interface on the touch screen to prevent wrong operation and setting ; the top heater device and mounting head 2in1 design and ball screw drive, Z-axis movements are controller DY Panasonic servo system which can accurately control the site and hot-spots. Automatic identification of material and the height of mounting, automatic soldering and de-soldering, it can show 3 temperature curves in the touch screen after launch with the time passing, temperature precision within ±2℃, heating temperature, time, rate, cooling, alarm all display in the touch screen, With different size alloy BGA nozzles, 360 degree rotation, easy to install and replace,5. Joystick control the optical system, the optical lens can be moved manually left and right, back and front freely, Observed all aspects of the BGA chip, displayed clearly, The X.Y axis and R angle with micrometer adjust, precise positioning, alignment accuracy is ±0.01mm, V-groove, PCB support can be adjusted in any direction with external universal fixture. PCB Size Max:700*650mm Min:10*10mm Heater power Upper temp. zone 1200w, second temp. zone 1200w, IR temp. zone 7200w BGA Size 1*1-80*80mm Min. ball pitch 0.15mm Max Weight of BGA 1000g Placement precision ±0.01mm PCB Locating Way Outer or location hole Temperature Controlling Ksenso closed loop control ,independent temperature control Total Power 98 9800wfull auto BGA rework equipment Power AC380V±10% 50/60Hz Skype sales005-wisdomshow What's App +86 13266540971